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Stay Ahead with Daily Hardware & Semiconductors Innovation Insights

  • by Charles Murray
    Broader appeal for the electric car is a big challenge. Innovation is still the best solution. The post Electric Car Makers Need to Appeal to the ‘Other 90%’ appeared first on EE Times.
  • by Pablo Valerio
    At AutoSens Europe, automotive sensing designs reflected tighter safety standards, advances in AI processing, and growing cybersecurity requirements. The post AutoSens 2026: Regulation Drives Automotive Sensing Architectures appeared first on EE Times.
  • by Yashasvini Razdan
    Analog Devices India’s Praveen Jose said device miniaturization is driving higher performance and quality in smaller form factors. The post Continuous Health Monitoring Drives Integrated Wearable System Design appeared first on EE Times.
  • by Jim McGregor, Francis Sideco
    Qualcomm introduced two distinct Snapdragon 8 Elite Gen 6 SoCs for high-end smartphones as it expands personal agentic AI across mobile, wearables, and PCs. The post Qualcomm Doubles Down on Agentic AI at Snapdragon Summit 2026 appeared first on EE Times.
  • by Arrow Electronics, Microchip
    Join us where attendees will see how on-device processing improves resilience, reduces exposure of sensitive data, counters spoofing, and supports practical deployment across buildings, smart locks, vehicles and appliances. The post Edge Computing and Security for Access Control Applications: Getting the Best of the Two Worlds appeared first on EE Times.
  • by MRPeasy
    Instead of traditional ERP, small electronics manufacturers are finding that affordable SME-focused manufacturing software provides needed functionality. The post Small Electronics Manufacturers Save Big on ERP  appeared first on EE Times.
  • by Francesca Pinto, SPEA Electronic Test Products Copywriter
    Are you struggling with PCBA defects? Learn how to optimize your PCBA testing strategy by combining In-Circuit Testing (ICT), Functional Testing (FCT with Bed-of-Nails or Flying Probe Testers. The post PCBA Test Strategies: How to Select the Right Methodology and Tester appeared first on EE Times.
  • by Pablo Valerio
    Europe's strategic space independence will depend on semiconductor supply chains, satellite networks, and 6G communications. The post Europe’s Space Industry Seeks Greater Supply Chain Control appeared first on EE Times.
  • by Yashasvini Razdan
    See how Emergence AI is deploying neuroformal AI with chipmakers to boost wafer yields and tackle fab, test, and packaging failures. The post Emergence AI Targets Fabless Chipmakers With Neuroformal AI appeared first on EE Times.
  • by Ron Honig
    TSMC’s 3-nm node nears the revenue lead, but history shows 7 nm ramped faster; compare the data before evaluating 2 nm. The post TSMC’s 3-nm Ramp Looks Different in Historical Context appeared first on EE Times.
A diverse group of individuals collaborating around a table with laptops, brainstorming ideas with a rocket model and charts in the background, symbolizing innovation in startups.
An overview of hardware and semiconductors with two images illustrating the topic.
  • by Geoff Tate
    AI is the biggest revolution of our lives, and it will grow exponentially into the 2030s. The post The Agentic AI Super Cycle appeared first on Semiconductor Engineering.
  • by Liz Allan
    Orbital data centers, defense systems, quantum computing, particle physics, and advanced manufacturing are raising the bar for simulation, test, and lab tools. The post Extreme Environments Push Chips To Their Breaking Point appeared first on Semiconductor Engineering.
  • by Technical Paper Link
    Researchers at Infineon Technologies and Technical University of Munich published a technical paper titled “From Physical Devices to RTL Models: Abstraction and Validation in Hardware Engineering.” Abstract: “This paper introduces the foundational principles underlying hardware engineering models and argues that abstraction is their defining characteristic. Because abstraction necessarily omits detail and constrains what engineers can… » read more The post Tracing Hardware Design From Physical Devices to RTL (Infineon, TU Munich) appeared first on Semiconductor Engineering.
  • by Technical Paper Link
    Researchers at the UC Berkeley and FuriosaAI published a technical paper titled “Characterizing High Bandwidth Flash for LLM Serving.” Abstract “Large language model (LLM) serving requires substantial memory to store model weights and KV caches. As models grow larger and contexts become longer, memory capacity and bandwidth increasingly become bottlenecks for serving performance. Agentic workloads… » read more The post HBF for High-Throughput LLM Serving (UC Berkeley, FuriosaAI) appeared first on Semiconductor Engineering.
  • by Technical Paper Link
    Researchers at Georgia Institute of Technology, Qatar Computing Research Institute, and Purdue University published a technical paper titled “A Formal Security Analysis of CAN XL.” Abstract: “For decades, the Controller Area Network (CAN) has been the backbone of in-vehicle communication. As modern vehicles integrate cameras, LiDARs, and AI components, classic CAN (CAN CC) faces growing… » read more The post Formal Automotive Security Analysis Of CAN XL (Georgia Tech, QCRI, Purdue) appeared first on Semiconductor Engineering.
  • by Vidya Chandran Darbari
    As artificial intelligence makes creation abundant, proof becomes the new scarcity. The post The Proof Economy appeared first on Semiconductor Engineering.
  • by The SE Staff
    Autonomous workflow design; CFETs push scaling beyond 10 angstroms; onsemi-Synaptics deal revised; physical AI M&A and funding; AI data centers drive new power/packaging investments; new Spectre-v2 attack targets JIT compilers; photonics moves closer to compute; quantum HW; false base station risks; 88k engineers needed. The post Chip Industry Week In Review appeared first on Semiconductor Engineering.
  • by Ann Mutschler
    As models evolve faster than silicon cycles, chip architects must balance flexible compute, data movement, and defense-in-depth security. The post The Hidden Challenges of Edge AI Design appeared first on Semiconductor Engineering.
  • by Brendan Heffernan
    The shift from software-defined to AI-defined vehicles raises questions about whether the hardware can keep up. The post AI-Defined Vehicles Push Compute, Memory, And Validation Limits appeared first on Semiconductor Engineering.
  • by Liz Allan
    On-device AI can deliver faster insights, greater autonomy, and less cloud traffic — but only with the right infrastructure. The post Turning Edge AI Data Into Real-Time Action appeared first on Semiconductor Engineering.