Stay Ahead with Daily Hardware & Semiconductors Innovation Insights
- by GLOBAL UNICHIP CORP. (GUC)Global Unichip Corp. (GUC), the Advanced ASIC Leader, will showcase Jotunn8, a next-generation data center AI inference processor developed by VSORA, at the TSMC Europe Technology Symposium. The post GUC Showcases VSORA’s Jotunn8 AI inference Processor at the TSMC Europe Technology Symposium appeared first on EE Times.
- by Echo ZhaoHuawei's answer to Moore's Law without EUV promises 14A performance by 2031. The post From Shrinking Transistors to Compressing Time: Deciphering Huawei’s τ Law appeared first on EE Times.
- by Yashasvini RazdanThe Singapore-based startup develops optical transceivers for the next generation of data center infrastructure. The post LightSpeed Photonics Targets AI Data Centers With 400-Gbps Near-Packaged Optical Interconnects appeared first on EE Times.
- by EE Times ChinaAction Technology, an IC design company, provides core technological support for hundreds of millions of consumer audio devices worldwide. The post You May Not Know Actions Technology, But You’ve Definitely “Heard” It appeared first on EE Times.
- by Steve Mansfield-DevineHowever much you prototype and test your product designs, there will always be factors outside your direct control that have significant implications for the manufacturability, efficiency, reliability and expected lifespan of your final product. One of the most important of these is the quality of the PCBs you receive from your chosen fabrication house. Many […] The post Realising the Benefits of Quality Inspection Reports appeared first on EE Times.
- by Bill SchweberThe power and thermal issues of placing data centers in space are formidable. The post Data Centers in Space: A Brilliant Idea or Delusional? appeared first on EE Times.
- by Pat BransA $2 billion CHIPS Act package backs quantum hardware across major modalities, underscoring Washington’s view of quantum computing as strategic infrastructure. The harder task is turning that hardware into useful applications. The post U.S. Quantum Bet Puts Hardware First, But Utility Remains the Test appeared first on EE Times.
- by Analog Devices and Arrow ElectronicsDate: Tuesday, June 30, 2026 Time: 15:00 CEST As the Space market evolves and accelerates, mission designers need space-capable electronics that balance performance, reliability, and affordability, without sacrificing speed to deployment. Join this webinar where we’ll explore ADI’s approach to supporting New Space programs through our purpose-built screening flows: Commercial Space Low (CSL) and Commercial Space […] The post Commercial Space Screening Approach for Agile, High-Reliability Payloads appeared first on EE Times.
- by Pablo ValerioWashington signals its intent to lead the quantum computing revolution with a $2 billion investment and equity stakes. The post U.S. Injects $2B into Quantum Computing Companies appeared first on EE Times.
- by Nitin DahadCo-optimization and collaboration were key themes at ITF World 2026, alongside imec’s Neuropixels 3.0 research and imec.ventures’ work with startups. The post Imec Says AI Scaling Needs More Orchestration Across Research, Design, Manufacturing appeared first on EE Times.
- by Linda ChristensenSRAM-based LLM inference; semantics-aware memory hierarchy for LLM reasoning; large-scale 2D material transfer; RISC-V vector performance portability; morphological mask optimization; trustworthy GenAI for automotive systems; HW-native GPU compilers for ML production. The post Chip Industry Technical Paper Roundup: May 26 appeared first on Semiconductor Engineering.
- by Jesse AllenThree approaches toward energy-harvesting displays. The post Research Bits: May 26 appeared first on Semiconductor Engineering.
- by Technical Paper LinkResearchers from Stanford University and Google have published “ITHICA: Intra-Thread Instruction Checking Approach for Defect-Induced Silent Data Corruptions”. Abstract “Hyperscaler reports of silent data corruptions (SDCs)—presumed to be caused by silicon manufacturing defects—have motivated the development of functional tests for detecting defective CPUs and their use in hyperscaler fleet studies. Interestingly, all such tests seem… » read more The post Detecting Defect-Induced Silent Data Corruptions in CPUs (Stanford, Google) appeared first on Semiconductor Engineering.
- by Technical Paper LinkA new technical paper, “Impact of Band-to-Band Tunneling in the Charge Trap Layer of NAND Flash Memory,” was published by researchers from University of Seoul and Samsung Electronics. “This article investigates the impact of band-to-band tunneling (BTBT) occurring in the charge trap layer (CTL) of vertical NAND (V−NAND) flash memory under excessive erasure conditions and… » read more The post Impact of Band-to-Band Tunneling in the CTL of V-NAND Flash Memory (U. of Seoul, Samsung) appeared first on Semiconductor Engineering.
- by Technical Paper LinkResearchers from Columbia University and IBM Research have released “HSCO-Bench: An Agent-Driven End-to-End Hardware-Software Co-design Benchmark for Systems-on-Chip”. Abstract “Large language models (LLMs) are adopted for software and hardware design, yet these domains are still evaluated separately. Software benchmarks typically assume fixed hardware targets, while hardware benchmarks focus on component-level optimization without considering the full… » read more The post An Agent-Driven End-to-End HW-SW Co-Design Benchmark for Heterogeneous SoCs (Columbia, IBM) appeared first on Semiconductor Engineering.
- by Technical Paper LinkResearchers from Grenoble INP – UGA, CNRS, TIMA have released “Spying Across Chiplets: Side-Channel Attacks in 2.5/3D Integrated Systems”. Abstract “Advanced packaging and chiplet-based integration are increasingly adopted to build complex heterogeneous systems beyond the limits of monolithic scaling. While these architectures offer major benefits in terms of modularity, yield, and performance, they also introduce… » read more The post Side-Channel Risks Across 2.5D/3D Integration and Chiplet-Based Systems (Grenoble INP – UGA et al.) appeared first on Semiconductor Engineering.
- by Technical Paper LinkResearchers from AMD released “CompPow: A Case for Component-level GPU Power Management”. Abstract “The ever increasing demand for ML-driven intelligence in a wide spectrum of domains has led to ubiquity of GPUs. At the same time, GPUs are notorious for their power consumption needs and often dominate power allocation in a typical ML datacenter. While… » read more The post Improving GPU Energy Efficiency With Component-Level Power Management (AMD) appeared first on Semiconductor Engineering.
- by The SE StaffTaiwan, Europe packaging buildout; 2nm ramps; quantum big $; 2 new university hubs; agent honeypots; Samsung strike averted; extreme environment chip design; quantum-dot qubit device fabricated w/high-NA EUV; EU flagship power electronics project; CNTs. The post Chip Industry Week In Review appeared first on Semiconductor Engineering.
- by Technical Paper LinkA new technical paper, “SHIP: SRAM-Based Huge Inference Pipelines for Fast LLM Serving,” was published by researchers at Nvidia, with work done while at Groq. Abstract “The proliferation of large language models (LLMs) demands inference systems with both low latency and high efficiency at scale. GPU-based serving relies on HBM for model weights and KV… » read more The post Large-scale, SRAM-based LLM Inference Deployment (Groq) appeared first on Semiconductor Engineering.
- by Anders BlomCapturing important details without making calculations impractically expensive. The post Beyond Ideal Crystals: The Case For Scale In Atomistic Modeling appeared first on Semiconductor Engineering.
- Nvidia has finally retired its 20-year-old control panel for GeForce GPUs. From now on, new GeForce drivers will only include the Nvidia App.
- The Suwon District Court rejected the injunction filed by five employees from Samsung’s Device eXperience division.
- The Chinese government has imposed travel restrictions on key AI experts, requiring them to secure an approval before they can leave the country. Beijing is reportedly doing this to secure talent, which it now considers as a strategic resource, as it competes with the U.S. to gain supremacy in artificial intelligence.
- At Computex next month, Intel is expected to reveal a bunch of handhelds rocking its Arc G3 series of chips, and Acer is now rumored to be one of the manufacturers showing off its devices. New leaks say a "Predator Atlas 8" is in the works that, as the name suggests, will feature an 8-inch screen and might come in both the Arc G3 and G3 Extreme variants.
- AMD has been accused of 'bait-and-switch' tactics following changes to the licensing of Vivado on Linux.
- German media outlet PC Games Hardware benchmarks the Core 9 273PQE and compares it to modern mainstream processors.
- The Holo 360 replaces conventional LCD layering with a floating hologram-like image effect.
- A 3D printing enthusiast broke the 3DBenchy speed record with a cute little boat model printed in 59 seconds.
- We tested Arctic’s entry-level Freezer 36-S with AMD’s Ryzen 9 9950X3D, and it did better than you might expect for a single-tower air cooler.
- Grab all of the parts you'd need for an RTX 5080 gaming PC build in this Newegg combo for $3,189.99, saving you $919 on the parts compared to buying them separately.
- SK hynix has unveiled iHBM, a new thermal packaging architecture that embeds cooling elements directly into the HBM interface layer, reducing thermal resistance by 30% and helping future AI accelerators avoid performance-killing thermal throttling.
- Secure yourself online with a 27-month subscription from Surfshark. $67.23 sub drops to only $47.23 when you include a free $20 Amazon gift card with your purchase.
- Uber might be having a serious rethink about lavishing cash on AI services as management still can't draw a clear link between LLM use and beneficial results.
- TSMC responded by saying it expects employee profit-sharing bonuses to grow at a faster rate in 2026 than they did in 2025.
- Third-party firmware has unlocked the ability for Blu-ray players to rip physical game media for retro consoles, transforming the way game preservation and emulation will work for retro gaming enthusiasts.
- Zero-Day clock visualizes the effect of AI on software security and predicts that exploits will happen one minute after disclosure in 2027.
- A new Mercer report reveals that 99% of CEOs expect AI-driven layoffs within two years, with entry-level workers facing the biggest threat as companies slash junior roles despite many executives admitting AI investments still show weak or unproven returns.
- Lisuan Tech reports having sold out 30,,000 preorder LX 7G100 graphics cards with a second batch on June 18.
- Imec unveiled the world’s first silicon quantum dot qubit device fabricated with High-NA EUV lithography, suggesting quantum computing may eventually scale using the semiconductor industry’s existing advanced manufacturing ecosystem.
- Testing GPU Safeguard+ on the MSI MPG Ai1600TS PSU – solution aims to tame melting 16-pin connectorsAt CES 2026, MSI unveiled a new lineup of power supplies under its MPG and MAG series. The 2026 MPG models are available in 1600W and 1300W variants and feature server-grade SiC MOSFETs designed to deliver a high level of stability and power efficiency. However, the standout addition is GPU Safeguard+, a new protection system aimed at preventing the overheating and melting issues associated with 12V-2×6 GPU power connectors.
